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| IPB160N04S3-H2 OptiMOS(R)-T Power-Transistor Product Summary V DS R DS(on) ID 40 2.1 160 V m A Features * N-channel - Enhancement mode * Automotive AEC Q101 qualified * MSL1 up to 260C peak reflow * 175C operating temperature * Green package (RoHS compliant) * Ultra low Rds(on) * 100% Avalanche tested PG-TO263-7-3 Type IPB160N04S3-H2 Package PG-TO263-7-3 Marking 3QN04H2 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current Symbol ID Conditions T C=25C, V GS=10V1) T C=100 C, V GS=10 V2) Pulsed drain current2) Avalanche energy, single pulse Gate source voltage Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS V GS P tot T j, T stg T C=25 C T C=25 C I D=80 A Value 160 157 640 898 20 214 -55 ... +175 55/175/56 mJ V W C Unit A Rev. 1.0 page 1 2007-04-16 IPB160N04S3-H2 Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics2) Thermal resistance, junction - case SMD version, device on PCB R thJC R thJA minimal footprint 6 cm2 cooling area3) Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D= 1 mA V GS(th) I DSS V DS=V GS, I D=150 A V DS=40 V, V GS=0 V, T j=25 C V DS=40 V, V GS=0 V, T j=125 C2) Gate-source leakage current Drain-source on-state resistance I GSS RDS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=80 A 40 2.1 3.0 4.0 1 A V 0.7 62 40 K/W - 1.6 100 100 2.1 nA m Rev. 1.0 page 2 2007-04-16 IPB160N04S3-H2 Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics2) Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics2) Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current2) Diode pulse current2) Diode forward voltage Reverse recovery time2) Reverse recovery charge2) 1) C iss C oss Crss t d(on) tr t d(off) tf V DD=20 V, V GS=10 V, I D=80 A, R G=3.3 V GS=0 V, V DS=25 V, f =1 MHz - 7400 2000 310 30 16 46 17 9600 2600 465 - pF ns Q gs Q gd Qg V plateau V DD=32 V, I D=80 A, V GS=0 to 10 V - 38 25 110 5.2 50 45 145 - nC V IS I S,pulse V SD t rr Q rr T C=25 C V GS=0 V, I F=80 A, T j=25 C V R=20 V, I F=50A, di F/dt =100 A/s - 0.85 60 95 160 640 1.3 - A V ns nC Current is limited by bondwire; with an R thJC = 0.7 K/W the chip is able to carry 221 A at 25C. For detailed information see Application Note ANPS071E at www.infineon.com/optimos 2) 3) Defined by design. Not subject to production test. Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.0 page 3 2007-04-16 IPB160N04S3-H2 1 Power dissipation P tot = f(T C); V GS 6 V 2 Drain current I D = f(T C); V GS 6 V 250 180 160 200 140 120 150 P tot [W] I D [A] 100 50 0 0 50 100 150 200 100 80 60 40 20 0 0 50 100 150 200 T C [C] T C [C] 3 Safe operating area I D = f(V DS); T C = 25 C; D = 0 parameter: t p 1000 1 s 4 Max. transient thermal impedance Z thJC = f(t p) parameter: D =t p/T 100 0.5 10 s 100 s 10-1 0.1 Z thJC [K/W] 1 ms 0.05 I D [A] 100 0.01 10-2 single pulse 10 0.1 1 10 100 10-3 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 1.0 page 4 2007-04-16 IPB160N04S3-H2 5 Typ. output characteristics I D = f(V DS); T j = 25 C parameter: V GS 6 Typ. drain-source on-state resistance R DS(on) = (I D); T j = 25 C parameter: V GS 14 600 10 V 7V 5.5 V 6V 6.5 V 7V 12 500 10 400 6.5 V R DS(on) [m] 8 I D [A] 300 6V 6 200 5.5 V 4 100 5V 2 10 V 0 0 2 4 6 0 0 100 200 300 400 500 600 V DS [V] I D [A] 7 Typ. transfer characteristics I D = f(V GS); V DS = 6V parameter: T j 8 Typ. drain-source on-state resistance R DS(on) = f(T j); I D = 80 A; V GS = 10 V 3 600 500 2.5 R DS(on) [m] 175 C 400 I D [A] 2 300 200 1.5 100 25 C -55 C 0 2 3 4 5 6 7 8 1 -60 -20 20 60 100 140 180 V GS [V] T j [C] Rev. 1.0 page 5 2007-04-16 IPB160N04S3-H2 9 Typ. gate threshold voltage V GS(th) = f(T j); V GS = V DS parameter: I D 4 10 Typ. capacitances C = f(V DS); V GS = 0 V; f = 1 MHz 105 3.5 3 1500A 104 Ciss V GS(th) [V] 150A 2.5 C [pF] Coss 2 103 1.5 Crss 1 -60 -20 20 60 100 140 180 0 5 10 15 20 25 30 T j [C] V DS [V] 11 Typical forward diode characteristicis IF = f(VSD) parameter: T j 103 12 Typ. avalanche characteristics I AS = f(t AV) parameter: T j(start) 1000 102 100 100C 25C I AV [A] I F [A] 150C 175 C 25 C 101 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1 1 10 100 1000 V SD [V] t AV [s] Rev. 1.0 page 6 2007-04-16 IPB160N04S3-H2 13 Typical avalanche energy E AS = f(T j) parameter: I D 4000 3500 3000 2500 20 A 14 Drain-source breakdown voltage V BR(DSS) = f(T j); I D = 1 mA 52 48 2000 1500 1000 80 A V BR(DSS) [V] 40 A 44 E AS [mJ] 40 36 500 0 25 75 125 175 32 -60 -20 20 60 100 140 180 T j [C] T j [C] 15 Typ. gate charge V GS = f(Q gate); I D = 80 A pulsed parameter: V DD 12 16 Gate charge waveforms V GS 10 8V 32 V Qg 8 V GS [V] 6 4 2 Q gs Q gd Q gate 0 0 20 40 60 80 100 120 Q gate [nC] Rev. 1.0 page 7 2007-04-16 IPB160N04S3-H2 Published by Infineon Technologies AG 81726 Munich, Germany (c) Infineon Technologies AG 2007 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 2007-04-16 IPB160N04S3-H2 Revision History Version Date Changes Rev. 1.0 page 9 2007-04-16 |
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